NVIDIA B300

B300, or Blackwell Ultra, is NVIDIA’s follow-on to its B200 GPU. It will have the same power consumption as B200 but is new silicon.

Each GPU will have¹

• 2 reticle-sized GPUs
• 15 PF dense FP4
• 288 GB HBM3e

GB300 NVL72

GB300 NVL72 is advertised to have:¹

• 1.5x GB200 NVL72
  • 1.1 EF dense FP4 for inference
  • 360 PF FP8 for training
  • 20 TB HBM at 576 TB/s
  • 40 TB “Fast Memory”
  • 18 NVLink Switches at 130 TB/s
  • 130 trillion transistors
  • 2,592 Grace CPU cores
  • 72 ConnectX-8 NICs
  • 18 BlueField DPUs

GB300 NVL72 maintains compatibility with the GB200 NVL72 Oberon rack but has a few notable differences:

• It is a single carrier board with two Grace CPUs and four Blackwell GPUs instead of two identical boards with 1C:2G each.
• Mellanox ConnectX-8 NICs are included on the board now
• CPUs, GPUs, and NICs are all socketed and individually replaceable now
• The server is designed to be 100% liquid-cooled

Here is a photo of the GB300 NVL72 superchip board I took at GTC25:

From top to bottom are the NVLink connectors (orange), four B300 GPUs, two Grace CPUs, and four ConnectX-8 NICs (copper).

Here is HPE’s implementation of the GB300 NVL72 server sled:

A liquid manifold replaces the row of fans that was in the GB200 NVL72 server platform.

It uses the same rack power and liquid infrastructure, fits within the same rack power density, and maintains 72 GPUs per NVLink domain.² It debuted at GTC25.

The photo below shows the DGX GB300 (left) and DGX GB200 (right). They are indistinguishable.

Footnotes

1. Jensen Huang’s Keynote at GTC25. ↩ ↩²

2. Nvidia’s Jensen Huang, Ian Buck, and Charlie Boyle on the future of data center rack density ↩